MediaTek Dimensity 7300 Series Chipsets with Enhanced AI and Connectivity

MediaTek Dimensity 7300 Series Chipsets with Enhanced AI and Connectivity
MediaTek Dimensity 7300 Series Chipsets with Enhanced AI and Connectivity/Reuters
MediaTek Dimensity 7300 Series Chipsets with Enhanced AI and Connectivity
MediaTek Dimensity 7300 Series Chipsets with Enhanced AI and Connectivity/Reuters

MediaTek Dimensity 7300 Series Chipsets with Enhanced AI and Connectivity

MediaTek Dimensity 7300 Series Chipsets with Enhanced AI and Connectivity

MediaTek Dimensity 7300 Series Chipsets with Enhanced AI and Connectivity

Key Highlights:

  • Dimensity 7300 and Dimensity 7300X chipsets introduced with advanced AI computing.
  • Built on TSMC’s 4nm process, offering up to 25% lower power consumption.
  • Designed for multitasking, gaming, and image processing in smartphones.

MediaTek announced its latest Dimensity 7300 series chipsets on Thursday, showcasing the Dimensity 7300 and Dimensity 7300X models. These chipsets boast advanced AI computing capabilities and are specifically designed to enhance multitasking experiences.

Built on TSMC’s advanced third-generation 4nm process technology, the Dimensity 7300 series promises up to 25% lower power consumption compared to its predecessor, the Dimensity 7050 SoC. Notably, the Dimensity 7300X variant is tailored for flip-styled foldable smartphones, supporting dual displays.

The octa-core CPU configuration includes four Arm Cortex-A78 cores clocked at 2.5GHz and four Arm Cortex-A55 efficiency cores. Paired with the Arm Mali-G615 GPU and MediaTek’s HyperEngine optimizations, these chipsets aim to elevate gaming experiences on smartphones.

In addition to gaming enhancements, the chipsets feature optimizations for resource utilization, 5G connectivity, and Wi-Fi game connections. They support Bluetooth LE audio technology and Dual-Link True Wireless Stereo (TWS) audio for seamless wireless audio experiences.

For image processing, the Dimensity 7300 series integrates the MediaTek Imagiq 950 ISP, boasting a 12-bit HDR ISP and supporting up to a 200-megapixel primary camera. Hardware engines include Multi-Channel Noise Reduction (MCNR), HWFD (Hardware Face Detection), and video HDR capabilities, ensuring superior photo and video quality in various lighting conditions.

The chipsets also excel in AI computing tasks, powered by the MediaTek APU (Agent Processing Unit) 655, which enhances AI task efficiency and accommodates mixed-precision data types. This enables better memory bandwidth utilization and reduces memory requirements for larger AI models.

On the connectivity front, the Dimensity 7300 chipsets offer improved power efficiency in 5G sub-6GHz connections and support up to 3.27Gb per second 5G downlink via 3CC carrier aggregation. Additionally, they feature dual 5G SIM support, dual VoNR (Voice over New Radio), and tri-band Wi-Fi 6E for enhanced connectivity experiences.

(Gadgets 360)

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